- ?????????????????????????????г?????-2019?桷
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- ????????????????-2018?桷
- ??????????е?LiDAR????????????????LiDAR????????
- ???MEMS?????????????????????3D??????????
- ???MEMS???????????γ?
- ??????LED???????????????????ú????????
- ???/??????2018~2019??iPhone??????????????
- 2018??MEMS?г?????127???????δ????????????????
?????Mate 20 Pro???3D??????????
2019-02-12 14:09:34 ???????????? ?????0 ?????
Huawei Mate 20 Pro’s 3D Depth-Sensing System
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???Mate 20 Pro???3D????????????3D???????????????????????DOE?????????????????
???Mate 20 Pro?????3D????????
??????????????????й????????????????OPPO??С??????????????????????Mate 20 Pro?в?????3D????????????“OPPO??С????3D?????????????????Щ??Э”????????????????????????????????????????WLO??????????????3D???н???????????????????Χ??DOE???????????3D????????????????ú?????????????????????????飩??????????????????GS????????IR?????????
???Mate 20 Pro???3D????????????????????
???Mate 20 Pro?????ù?????м???????????????????????RGB???????顢?????????????????????????????????????????????????????????????ɡ?
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???????3D?????????????????3D?????????????????????????????????????????????CEO??ж?????????Mate 20 Pro???HUAWEI Pay????????????????????????????Mate 20 Pro???3D???????????????3D??????渴?????????“???”??
?????????Mate 20 Pro???3D????????????????????????????????????????????????????г?????????????????????????????????????????淢?傷??????VCSEL?????????????????????????????????????????????????????????????????????????????????????????????????????????????????????WLO?????????????????????
?????????滹????3D???????????г??????????????????????????????3D?????????ж????????????iPhone X??OPPO Find X??С??8???????檔
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Overview/Introduction
Huawei - Company Profile
Mate 20 Pro Edition – Teardown and Market Analysis
Physical Analysis
• Physical Analysis Methodology
• NIR Camera Module Disassembly and Cross-Section
• Sensor Die
- View, dimensions, pixels, pads, markings, die process and cross-section
• DOT Projector & Flood Illuminator – Module Disassembly and Cross-Section
• WLO
- View, dimensions, process and cross-section
• NIR VCSEL Dies
- View, dimensions, die process and cross-section
• Physical Data Summary
Physical Comparison: Apple iPhone X, Oppo Find X, and Xiaomi Mi 8 Explorer
• System Integration
• NIR Camera Module and Sensor
• Dot Projector Module and VCSEL
Manufacturing Process Flow
• Die Fabrication Unit : NIR Image Sensor, NIR VCSEL, WLO
• NIR VCSEL Process Flow
Cost Analysis
• Cost Analysis Overview
• Supply Chain Description and Yield Hypotheses
• NIR Image Camera Module Cost
- Front-end (FE), microlens and total FE cost
- Wafer and die cost
- Lens module and assembly cost
• NIR VCSEL Die Cost
- FE cost
- FE cost, per process step
- Wafer and die cost
- Lens module and assembly cost
• WLO - Die Cost
- FE cost
- Wafer and die cost
Estimated Price Analysis: NIR Camera Module, Dot Projector Module and Optical Hub
??????????Mate 20 Pro???3D??????????????????????E-mail??wangyi#memsconsulting.com??#????@????
????????????3D???? 3D????? VCSEL ???????????
?????????????????г?-2018?桷
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